| Featuring |
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Concept to delivery of PCB Assembly and
subsystems |
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New product introduction support |
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Dedicated materials and logistics support |
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Global supply chain management |
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PCB assembly / advanced packaging |
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Surface mount / through hole / mixed technology
Fine pitch capability (Including BGA)
Double side assembly |
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System level assembly including connectors. |
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High volume / low mix, low volume / high
mix environment |
| Manufacturing capabilities |
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Fully automated assembly line |
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Precision solder stencil printing
and glue application |
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State of the art high-speed
vision aligned pick & place machines. |
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Capability to place 0201 components
to BGAs. |
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Solder re flow furnaces with
precision temperature control |
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Multiple solder melting temperature
for sequential Manufacturing. |
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Dual wave soldering machine
for through hole and mixed technology assemblies. |
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In circuit testing as well
as functional testing. |
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Temperature and environmental
testing. |